Internship: Software Developer for Chip Package Board Co Design (f/m/div)

Infineon Technologies Austria AG

Villach - vor 30+ T

  • Stelleninserat
  • Arbeitgeber

Internship: Software Developer for Chip Package Board Co Design (f/m/div)

At a glance

This specific internship is suitable for students within a degree program in Computer Science, Electrical Engineering or similar! At Infineon's Design Center Villach (DCV) we connect the real with the digital world. We focus on the development of circuits that process digital and analog signals. Our team in Villach is looking forward to receiving your application!

Quick info

Location

Villach

Entry level

0-1 year

Job ID

HRC0688752

Start

as soon as possible

Type

Full time / Part time

Contract

Temporary

Job description

In your new role you will:

* Work with the Chip Package Board Co Design team to design, implement, test, and maintain software solutions primarily using Python, Java, Perland Cadence SKILL
* Participate in code reviews and provide feedback to other developers
* Develop and maintain documentation, test plans, and other standards related to software development
* Work with the programming language "Cadence SKILL" in the EDA framework to develop software solutions for Chip Package Board Co Design
* Learn "Cadence SKILL" and assist in the development of software solutions
* Keep up to date with the latest trends and advancements in software development and EDA
* Contribute to the development of project plans, timelines, and milestones
* Work with cross-functional teams to understand and support business requirements

Further Information
Type of employment: Temporary / Full-time or Part-time (flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.)
Duration: min. 12 months

Profile

You successfully meet the requirements, if you are a motivated and committed student from the field of Computer Science, Electrical Engineering or similar. You are best equipped for this task if you additionally offer:

* Experience in software development using Python, Java, and Perl
* Familiarity with software development methodologies and tools, such as Agile, Git, and Jira
* Interest in learning "Cadence SKILL" programming language
* Strong analytical and problem-solving skills with the ability to work independently and as part of a team
* Excellent written and verbal communication skills to effectively collaborate with cross-functional teams and stakeholders
* A passion for staying up to date with the latest advancements in software development and EDA
* Excellent English skills with German as a plus

This position is subject to the collective agreement for workers and employees in the electrical and electronics industry (full-time), employment group B for bachelor students, employment group D for master students (https://www.feei.at/wp-content/uploads/2022/05/minimum-salaries-white-collar-workers-2023.pdf).

Please attach the following documents (German or English) to your application:
* Motivation letter
* CV
* Certificate of matriculation at a university
* Latest Transcript of records (not older than 6 months)
* Highest completed educational certificate (Matura certificate for Bachelor students, Bachelor certificate for Master students)
* Reference letter (optional)

About Us

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

The central R&D organization Design Enabling and Services" (DES) provides the design environments (design-systems) to the different product development teams at Infineon. With leading edge design methods, complex building blocks and a wide range of product development services DES enables Infineons advanced IC development. This means the complete value creation chain from abstract system models down to the fully verified product layout which ensures high quality manufacturing readiness.

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.

Infineon Hub - Connect. Create. Challenge.

The iHub at TU Wien represents an inspiring tech platform, networking area and event location, connecting Infineon Austria with tech experts, science specialists and young professionals.

Check out our upcoming events:
Infineon iHub

Contact Us

Sabrina Nindler

Apply now

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